Thin Film Build to Print Request for Information Form

This form was developed as a template to make it easy for our customers to enter the information DLI needs for an initial assessment of Build-To-Print Thin Film performance, size and cost. After submitting this form DLI Applications Engineering will contact you. Note: This is not an order form. There is no obligation until you are confident in our capabilities and actually decide to place an order.

One of the initial questions that might occur to someone visiting our BTP site is - What sets us apart?

▲ DLI has the ability to fully characterize ceramic plates (K & Kent testing)

▲ DLI has the ability to RF Probe and Test through 67GHz

We do not know of any other vendor that can do these things!

What are we capable of? Do we fit your requirements?

▲ Fine line geometries – Line/Space Capability~<0.5 mil

▲ Broad range of ceramics & metals – K-values 4 to 4,000

▲ Custom match Thermal Coefficient of Expansion (TCE) -Epsilon Relative – Er

▲ Capable of passive device design

▲ Interdigitated Capacitors, Inductors, Resistors, etc.

▲ Metalized Vias (Standard and Reinforced)

▲ Lange Couplers, Polyimide Cross-overs and Cross-unders

▲ 2 sided aligned patterning

▲ Automated inspection and placement on tape

▲ Expert on Alumina [99.6%] (Al₂O₃), Aluminum Nitride (AlN), Fused Quartz-Silica (Si02), Titanates (Ti0₂), Zirconia (Zr0₂) and DLI custom formulated ceramics

▲ Partnerships with specialty contractors for Laser scribe & trim, via fill, thick/thin film Cu for high power applications

▲ Capable of Build-To-Print and/or Custom Thin Film designs to 67GHz - and if you want to miniaturize your designs to make them lighter, smaller and more temperature stable we have the custom ceramic materials and RF and Microwave Engineering design team to do that!

Ceramic Choices

Substrate Material:

Fused Quartz SiO2 Alumina Al2O3, 99.6% Aluminum Nitride AlN DLI CF k = 23 DLI PG k = 12.5 DLI LA k = 4.9 DLI AH k = 20 DLI CD k = 38 DLI CG k = 67 DLI NR k = 152

Additional material properties are listed on pages six and seven of the Build-to-Print Design Guide

Surface preparation: Substrate Thickness:

Please Select As Fired Ground/Machined/Lapped Polished 25 mil / 0.635 mm 20 mil / 0.508 mm 15 mil / 0.380 mm 10 mil / 0.250 mm 5 mil/ 0.125 mm

As a general rule of thumb the higher the frequency the thinner the substrate and the smoother the surface.

Increasing plate thickness allows larger plates which allow for more economical processing. Custom

thicknesses are available.

Device Footprint

Length: specify units mm or mil

Width: specify units mm or mil

Metal System

Top side Metal: TaN/TiW/Au TiW/AU TAN/TiW/Ni/Au TiW/Ni/Au TaN/TiW/Au/Cu/Ni/Au TiW/Au or Au+Cu/Ni/Au TiW/Ni/AuSn

Bottom Side Metal: TaN/TiW/Au TiW/AU TAN/TiW/Ni/Au TiW/Ni/Au TaN/TiW/Au/Cu/Ni/Au TiW/Au or Au+Cu/Ni/Au TiW/Ni/AuSn

Please see pages eight through eleven of the Build-to-Print Design Guide for details. Metal systems are easily

customizable to meet your demands. DLI can maintain 0.5 mil line width and spacing with a tolerance of 0.1 mil

when no vias are present for standard gold thicknesses. With vias DLI can maintain 1.0 mil line with and spacing

with a 0.2 mil tolerance.

Critical Pattern Features:

Minimum line width in your design: specify units mm or mil

Minimum line spacing in your design: specify units mm or mil

Mounting method

How is the device attached in the assembly? Also, are there additional components attached to the device?

Attachment information & info on additional components

Resistors

Type (if any): Notched Flush Tunable Other None

Resistor value(s):

Resistor tolerance:

Vias

Type (if any): Standard Filled Reinforced None

Smallest via diameter:

Via tolerance:

As a rule of thumb via diameters must be at least 60% of the device thickness and not less than 7 mils in diameter.

Special Packaging Requirements

DLI has the capability to provide components in wafflepacks, gel packs, chip/tray carriers, carrier tape, or on expanded membrane tape on photon rings. Low volumes will typically be shipped bulk in plastic cases sandwiched between blue foam and clean room paper. serialization, plate level segregation, etc. are also available options.

Packaging requirements

Testing requirements

Are there any special test requirements or application specific requirements? DLI has full RF characterization capability, materials characterization capability and reliability stress capability to satisfy all MIL and Space level requirements.

Special test requirements go here

NRE fee information

We prefer to pay NRE as a lump sum - if it is required
No, our company has a no NRE policy, please divide the NRE up and add to the device unit price

Budgetary volume

DLI typically quotes the volume requested. If you would like to see an additional high volume quote please provide as much visibility into your needs over the next year for the best possible price estimation.

Requested Volume:

Projected Yearly Volume:

Target price (High Volume): US Dollars

Export Controls

DLI products can be subject to Export Control Restrictions. A determination can be made quickly by providing the following information.

Please provide the End Use and End User if you are outside of the USA.

End Use:

End User:

What type of response would best describe what you are looking for?

Please select the alternative that most appropriately describes what you expect us to provide to you.

Contact us, we want to know more (1 day) Provide budgetary pricing (1-2 days) We want to have this device built and would like to know how to place and order for parts (6-10 weeks)

Contact Information

To facilitate further discussion or information please provide your contact information below.

Name:

Title:

Company:

Address:

Country:

Telephone:

Email:

DLI appreciates your time and effort; a DLI Application Engineer will contact you to discuss your build to print requirement. Or you can call DLI Inside Sales at +1 (315) 655-8710

You can also print and fax this form to our fax at +1 (315) 655-0445.

Thank you!